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Plasma Systems
T&C has created a practical and cost sensitive approach
to power delivery systems designed specifically for:
- Metal and dielectric
etching
- Photoresist ashing
- Sputter deposition
- Chemical vapor deposition (CVD)
- Plasma-enhanced chemical vapor deposition
(PECVD)
- Physical vapor deposition (PVD)
- RF cleaning
These plasma systems will ignite and maintain plasmas by
following the changes in the process to provide stable and
consistent operation. T&C has "off the shelf" systems that can
plug into your current application and provide better control
of process than is available
from other, more
expensive manufacturers.
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We are also willing to design special monitor and control interfaces
for specific applications.
The ability to monitor Forward, Reflected and Load power
in real time provides an ability to control and repeat a process
consistently time after time. Combined with precise power
control and frequency agility, process management can be fine-tuned
to a degree better than previously expected.
T&C Power System features:
- Proven, leading-edge design
- Integral equipment and process protection
- Process improvement
- Precise power regulation
- Compact dimensions, installation appropriate
- Great Serviceability
- Flexible calibrated control standards
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